Duresco Epoxy Moulding Compounds
Epoxy Moulding Compounds (EMC) are high-performance thermosetting materials that are able to be processed using compression, transfer or injection moulding.
Duresco Epoxy Moulding Compounds exhibit the following characteristics:
- Outstanding chemical resistance
- Excellent mechanical performance at high temperatures
- Excellent long term heat stability and thermal endurance (IEC 216)
- Excellent creep behaviour under load
- High electrical insulation properties; especially dielectic strength and creep resistance
- No post curing is required
- No further change in properties after reaction has finished
- Final properties are independent of wall thickness
- Low shrinkage equals low stress, no distortion, high dimensional stability and no shrink marks
- Excellent price/performance ratio
Applications:
Electronic Applications
Well sealed encapsulation of electronics under mild conditions possible due to low viscosity and cavity pressures.
Automation of the injection moulding process enables short cycle times and economic production.
The use of Duresco Epoxy Moulding Compounds guarantees reliable, long-term use under difficult climatic conditions.
Main Advantages: protection of electronics and sensors
- High dimension stability and thermal resistance
- Outstanding crack-resistance in case of thermal shock
- Improved thermal transfer due to good adhesion to inserts
- Low water absorption combined with outstanding chemical resistance
- Integrated housing
- No shrink marks caused by differences in wall thickness; very low wall thicknesses are possible
- Coefficient of thermal expansion suitable for use with the construction materials being encapsulated
- No post cure required; minimal post shrinkage
Example Applications:
- Modules
Electrical Engineering
Electrical engineering applications require materials with good electrical insulation properties, especially dielectric strength and creep resistance.
As a result of short cycle times, and no need to postcure, Epoxy Moulding Compounds from Duresco provide an alternative for low and medium-voltage applications and explosion-proof applications
Main Advantages:
- Short cycle times via the use of the transfer or injection moulding process
- No post cure required; minimal post-shrinkage
- Low coefficient of thermal expansion
- Good adhesion to inserts
- Outstanding crack-resistance in case of thermal shock, even at flow fronts
- Low creep under load
- Low water absorption combined with outstanding chemical resistance
- UL 94 V-0 listing
- Products with high glass transition temperatures of up to 160°C are suitable as insulation materials for construction parts subjected to permanent temperatures of up to 120°C
Example Applications:
- Bushings
- Insulators
- Explosion-proof switches
- Transformers
- Plug
Automation
In the area of automation, insulation materials are required that are able to completely seal construction materials due to the low processing viscosity combined with outstanding crack-resistance.
The resulting low processing pressures also enable additional electronic components to be integrated into this single production process.
The use of Duresco Epoxy Moulding Compounds guarantees reliable, long-term use under difficult climatic conditions.
Main Advantages:
- Integrated housing function
- High dimensional stability and temperature resistance combined with good mechanical properties
- Impregnation of windings; this enables sealing against media and improved heat dissipation
- Good adhesion to inserts
- Low water absorption combined with outstanding chemical resistance
- Low heat expansion properties suitable for use with metals
- No post cure required; minimal post-shrinkage
- No shrink marks caused by differences in wall thicknesses; very low wall thicknesses are possible
- Low creep under loadHigh dimension stability and thermal resistance
Example Applications:
- Magnetic coils
- Speed sensors
- Displacement sensors
- Modules
Automotive
Due to miniaturisation, encapsulation materials are needed in the automotive area that feature high temperature resistance combined with good electrical insulation properties and good chemical resistance. Low processing pressures also enable additional electronics components to be integrated within a single production process.
In contrast to metals, the use of high-performance plastics enables weight to be reduced. Automation of the injection moulding process enables short cycle times and a reduction of costs.
The use of Duresco Epoxy Moulding Compounds guarantees reliable, long-term use under difficult climatic conditions.
Main Advantages:
- Protection of electronics and sensors
- Integrated housing
- Outstanding crack-resistance in case of thermal shock
- No shrink marks caused by differences in wall thickness; very low wall thicknesses are possible
- Good adhesion to inserts
- Optimal sealing against media due to the low processing viscosity and improved heat dissipation
- Coefficient of thermal expansion suitable for use with the construction materials being encapsulated
- No post cure required; minimal post shrinkage
- Low creep under load
Main Advantages: Ignition electronics
- Good electrical creep, arcing, and dielectric strength even in difficult environmental conditions
- UL 94 V-0 listing
Example Applications:
- Insulation materials for ignition systems
- Diesel injection valves
- Speed sensors
- Potentiometers
Medical Technology
Medical technology requires the use of materials that are able to stand up to numerous sterilisation processes without being damaged.
Additionally products for computed tomography (CT scanner) require a high degree of resistance against x-rays.
Epoxy Moulding Compounds from Duresco possess properties that are outstanding for these demanding tasks.
Main Advantages:
- Outstanding resistance to high heat and humidity conditions and during the sterilisation process
- Good resistance to radiation
- No release of volatile materials
- High dimensional stability and temperature resistance combined with good mechanical properties
- Low water absorption combined with outstanding chemical resistance
- No post cure required; minimal post shrinkage
Low creep under load
Example Applications:
- Endoscopes
- Electronic protection in medical devices
- X-ray components
Power Train
In the area of electrical drive technology, insulation materials are required that possess a high degree of dimensional stability in order to securely fix the laminated core and the collector, even at high temperatures. In addition to this, good electrical insulating properties and crack resistance are required.
As a result of these specific material properties, the degree of efficiency of the drives is increased and energy is saved.
Epoxy Moulding Compounds from Duresco possess the properties to meet the demanding requirements of these high-quality applications.
Main Advantages:
- Integrated housing
- Impregnation of windings; this enables sealing against media and improved heat dissipation
- Encapsulation of loose windings
- High dimensional stability and temperature resistance combined with good mechanical properties
- Good adhesion to inserts
- Low water absorption combined with outstanding chemical resistance
- Low heat expansion properties suitable for use with metals
- No post cure required; minimal post shrinkage
- No emissions during curing
- Low creep under load
Example Applications:
- Disk rotors
- Rotors
- Stators